2024年11月18-21日，第十屆國際第三代半導體論壇（IFWS2024）&第二十一屆中國國際半導體照明論壇（SSLCHINA2024）、先進半導體技術(shù)應用創(chuàng)新展（CASTAS）將在蘇州國際博覽中心舉辦。
北京特思迪半導體設(shè)備有限公司將攜多款產(chǎn)品亮相此次展會。值此，誠摯邀請第三代半導體產(chǎn)業(yè)同仁共聚論壇，蒞臨B15號展位參觀交流、洽談合作。???
關(guān)于特思迪
北京特思迪半導體設(shè)備有限公司是一家擁有自主知識產(chǎn)權(quán)的國家高新技術(shù)企業(yè)，專注于半導體領(lǐng)域超精密平面加工設(shè)備的研發(fā)、生產(chǎn)和銷售。以“引領(lǐng)半導體技術(shù)進步，助力客戶發(fā)展”為使命，致力于成為全球技術(shù)領(lǐng)先的半導體設(shè)備制造企業(yè)。
Beijing TSD Semiconductor Equipment Co., it is a national high-tech enterprise with independent intellectual property rights, focusing on R&D, production and sales of ultra-precision plane processing equipment in the semiconductor field. With the mission of "Leading the Progress of Semiconductor Technology, Assisting Customers to Develop ", we are committed to become a global leading technology manufacturer of semiconductor equipment.
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公司多次承擔國家級、省級重大技術(shù)攻關(guān)項目，獲評國家專精特新“小巨人”企業(yè)，國家高新技術(shù)企業(yè)、中國（潛在）獨角獸企業(yè)等榮譽稱號。研發(fā)實力強勁，目前成立了朗途實驗室 & 礪晶實驗室，分別實現(xiàn)核心部件的自主研發(fā)與突破，以及設(shè)備+工藝的整體解決方案。
The company has undertaken numerous national and provincial major technological R&D projects, and has been awarded the title of National Specialized, Specialized and Innovative "Small Giant" Enterprise, National High-tech Enterprise, and China (Potential) Unicorn Enterprise, among others. Its R&D strength is strong, and it has established the Laboratory?and?Lijing Laboratory, which respectively realize the independent R&D and breakthrough of core components, as well as the overall solution of equipment and processes.
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產(chǎn)品介紹
特思迪成立以來，深耕半導體領(lǐng)域超精密平面加工設(shè)備的研發(fā)、生產(chǎn)和銷售，形成了技術(shù)領(lǐng)先、性能優(yōu)越、工藝穩(wěn)定的核心技術(shù)優(yōu)勢。先后成功發(fā)布多款擁有自主知識產(chǎn)權(quán)的多片式單/雙面拋光機、單片式拋光機、全自動雙軸減薄機、全自動化學機械拋光機等設(shè)備，工藝指標均達到國際領(lǐng)先水平，獲得頭部企業(yè)規(guī)模化訂單。成為國內(nèi)為數(shù)不多可為客戶提供減薄、拋光、CMP的系統(tǒng)解決方案和工藝設(shè)備整線輸出的半導體設(shè)備公司。
Since its establishment, TSD?has been deeply engaged in the research and development, production and sales of ultra-precision surface machining equipment in the semiconductor field, forming the core technical advantages of leading technology, superior performance and stable process. Has successfully released a number of independent intellectual property rights of multi-chip single/double-sided polishing machine, single-chip polishing machine, automatic dual-axis grinding machine, automatic chemical mechanical polishing machine and other equipment, the process indicators have reached the international leading level, obtained many the head enterprise scale orders.?Become one of the few semiconductor equipment companies in China that can provide customers with system solutions for grinding, polishing, CMP and the entire line output of process equipment.
公司產(chǎn)品體系分為襯底拋光、晶圓平坦化、晶圓薄化三大類。減薄、拋光和CMP都屬于半導體材料超精密平面加工技術(shù)，是半導體制造不可或缺的環(huán)節(jié)，廣泛應用于半導體襯底、晶圓制造、半導體器件、先進封裝等多個半導體制造環(huán)節(jié)。
The company's product system is divided into three categories: substrate polishing, Wafer planarization. Grinding, polishing and CMP are all ultra-precision planar machining technologies of semiconductor materials, which are indispensable links in semiconductor manufacturing and are widely used in semiconductor substrates, wafer manufacturing, semiconductor devices, advanced packaging and other semiconductor manufacturing links.
參會聯(lián)系
今年，第十屆國際第三代半導體論壇&第二十一屆中國國際半導體照明論壇（IFWS＆SSLCHINA2024）將于11月18-21日在蘇州國際博覽中心舉辦，國內(nèi)外院士專家齊聚，數(shù)十場會議活動，數(shù)百位報告嘉賓，全產(chǎn)業(yè)鏈知名企業(yè)參與&參展，內(nèi)容全面覆蓋行業(yè)工藝裝備、原材料、技術(shù)、產(chǎn)品與應用各環(huán)節(jié)，融合聚集產(chǎn)、學、研、用、政、金多個層面的資源，年度國際第三代半導體產(chǎn)業(yè)“風向標”盛會，11月相聚蘇州，共襄盛會，共謀發(fā)展！歡迎業(yè)界同仁咨詢參展參會，免費觀展交流合作！》》》最新60+報告嘉賓公布！IFWS&SSLCHINA2024報名中！
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